Electronic hardware engineer
13 years of industry experience
Deng Wenyi
Electronic hardware engineer
12 years of industry experience
Meng Dongquan
R&D chief
11 years of industry experience
Su Haifa
Hardware engineer
10 years of industry experience
Zhai Jingyong
Software Development Engineer
11 years of industry experience
HIGH AND NEW TECHNOLOGY
Prepared in Huizhou
Modern high-tech industrial park with a production capacity of 1 billion
Covers an area of 20,000 square meters, construction area of 60,000 square meters
Design Innovation
1.PCB soldering pad design:
○ We adhere to IPC-SM-782A; Ability to achieve 100% tin for pad design utilizing Haihe Tecnology‘s years of experience.
○ Capable of adding white oil silk screen isolation between solder joints, maintaining product stability
2.PCB layout design:
○ Reasonable layout and less turning, the lines are simple and clear, convenient for production and inspection.
○ High-current layout reasonably increases the width of the copper foil, and if necessary, tin is added on the copper foil to ensure the stability of the product.
3.PCB component placement design:
○ Reasonable placement of components to improve the soldering effect of the peaks and improve the stability of the product
Leading Position
3
Items
Patent
14
Items
Utility model patents
36
Items
Software copyright
Cooperative Customers
PCBA product cooperation customers
Internet of Things intelligent control cooperation customers